Layer	0-20 L
PCB Max. outside size	1100 x500 mm
Board Materials	FR-4; Aluminum Base; High Frequency; PFTE; FPC; Thick Copper; BT Base; Pi Base; Tg130℃/ Tg170℃, Rogers, Berquist, Thermagon, (Taconic),Flexi Rigids
Board Min thickness	0.2mm (2 layers) / 0.5mm (4 layers) /0.8mm (6 layers)/ 1.0mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers) / 1.8mm / 2.0 mm (18 layers) / 2.2mm (20 layers)
Board Max thickness	315mil(6.0mm)
Max copper thickness	6oz
Inner layer Min line width/space	3mil(0.075mm) / 3mil(0.075mm)
Outer layer Min line width/space	3mil(0.075mm) / 3mil(0.075mm)
Min finished drilling size	6mil(0.15mm)
Max aspect ratio	12:01:00
Min PTH via & pad size	via: dia. 0.2mm / pad: dia. 0.4mm ; HDI ≤0.10mm via
Min hole tolerance	±0.05mm(NPTH), ±0.076mm(PTH)
Finished hole tolerance(PTH)	±3mil(0.075mm)
Finished hole tolerance(NPTH)	±2mil(0.05mm)
PTH hole copper thickness	20um(1.0mil)
Accuracy from hole to hole	±2mil(0.05mm)
Outline line tolerance	±4mil(0.1mm)
Solder mask thickness	0.254mil(0.001mm)
Isolation Resistance	1 × 1012Ω
Hot impact	3 × 10Sec@288 ℃
Wrap/ twist	≤0.75%
Peel off	1.4N / mm
Solder mask abrasion	≥6H
Block burning level	94V – O
Impedance control	±10%
Min solder mask opening	0.05mm(2mil)
Min solder mask cover	0.05mm(2mil)
Min solder mask brige	0.1mm(4mil)
Surface treatment	flash gold; immersion gold/immersion silver; OSP; HAL/HAL lead free; halogen free; carbon; gold finger(30u”); immersion silver (3~10u”); immersion tin(0.6~1.2um); peelable mask
Gold finger thickness	0.76um max ( 30u” max )
V-cut angle	0.76um max ( 30u” max )
Min V-cut thickness	0.8mm
V-cut saving size tolerance	0.8mm
Outline	Routing & Punching
Testing accuracy	±0.1mm(4mil)
E-TEST voltage	250 ± 5 V